| 摘要 |
<p>1524063 Impedance matching DEFENCE SECRETARY OF STATE FOR 27 April 1976 [14 May 1975] 20470/75 Heading H1W For impedance-matching purposes in a microwave integrated circuit, at least one electrically conductive path (e.g. paths 5, 6, &c. as shown) is provided between the ground plane 4 and the surface of the substrate 2 which bears the circuit. As shown, the extensions 5, 6, &c. serve to match the input and output conductors 3 &c. of a microstrip hybrid ring circuit to the usual co-axial connectors. The circuit is mounted in a closed box (see, Fig. 3, not shown) to the walls of which are attached the co-axial connectors. The circuit may be of the thin-film or thick-film type and may, e.g. be made by a "silk-screen" printing technique using a stainless-steel screen and gold ink.</p> |
