Wiring substrate, its manufacturing method, and semiconductor device

摘要

One embodiment provides a wiring substrate including: a core substrate having an insulative base member, the insulative base member having a first surface and a second surface, a plurality of linear conductors penetrating through the insulative base member from the first surface to the second surface; an inorganic material layer joined to at least one of the first surface and the second surface of the insulative base member; and a penetration line penetrating through the inorganic material layer, wherein one end of the penetration line is electrically connected to a corresponding part of the linear conductors, without intervention of a bump.

主权项

1. A wiring substrate comprising:
a core substrate having an insulative base member, the insulative base member having a first surface and a second surface, a plurality of linear conductors penetrating through the insulative base member from the first surface to the second surface, the plurality of linear conductors being embedded in the core substrate such that an interval between any two adjoining linear conductors of the plurality of linear conductors is smaller than a diameters of each of the two adjoining linear conductors; an inorganic material layer joined to at least one of the first surface and the second surface of the insulative base member; and a penetration line penetrating through the inorganic material layer, wherein one end of the penetration line is directly connected to ends of a corresponding part of the plurality of linear conductors in the core substrate, without intervention of a bump.