| 发明名称 | Package on package structures and methods for forming the same | ||
| 摘要 | A method of forming a semiconductor device package includes removing a portion of a first connector and a molding compound surrounding the first connector to form an opening, wherein the first connector is part of a first package, and removing the portion of the first connector comprises forming a surface on the first connector which is at an angle with respect to a top surface of the molding compound. The method further includes placing a second connector in the opening, wherein the second connector is part of a second package having a semiconductor die. The method further includes bonding the second connector to a remaining portion of the first connector. | ||
| 申请公布号 | US9006032(B2) | 申请公布日期 | 2015.04.14 |
| 申请号 | US201414212233 | 申请日期 | 2014.03.14 |
| 申请人 | Taiwan Semiconductor Manufacturing Company, Ltd. | 发明人 | Cheng Jung Wei;Wang Tsung-Ding;Lee Chien-Hsun;Chuang Chun-Chih |
| 分类号 | H01L21/00;H01L23/02;H01L25/065;H01L23/31;H01L23/00;H01L25/10;H01L23/498 | 主分类号 | H01L21/00 |
| 代理机构 | Lowe Hauptman & Ham, LLP | 代理人 | Lowe Hauptman & Ham, LLP |
| 主权项 | 1. A method of forming a semiconductor device package, the method comprising: removing a portion of a first connector and a molding compound surrounding the first connector to form an opening, wherein the first connector is part of a first package, and removing the portion of the first connector comprises forming a surface on the first connector which is at an angle with respect to a top surface of the molding compound; placing a second connector in the opening, wherein the second connector is part of a second package having a semiconductor die; and bonding the second connector to a remaining portion of the first connector. | ||
| 地址 | TW | ||