| 发明名称 | Semiconductor apparatus and manufacturing method thereof | ||
| 摘要 | A semiconductor apparatus includes: a package substrate on which a semiconductor device is disposed; a mounting board over which the package substrate is mounted; a first restraint that penetrates through the mounting board and the package substrate, and restrains deformation of the mounting board and the package substrate in a direction in which the mounting board and the package substrate are separated from each other; and a second restraint that is disposed between the mounting board and the package substrate, and restrains deformation of the mounting board and the package substrate in a direction in which the mounting board and the package substrate are closer to each other. | ||
| 申请公布号 | US9006876(B2) | 申请公布日期 | 2015.04.14 |
| 申请号 | US201414225721 | 申请日期 | 2014.03.26 |
| 申请人 | Fujitsu Limited | 发明人 | Watanabe Manabu;Fukuzono Kenji;Baba Shunji |
| 分类号 | H01L23/02;H01L23/34;H01L23/00;H01L23/13 | 主分类号 | H01L23/02 |
| 代理机构 | Squire Patton Boggs (US) LLP | 代理人 | Squire Patton Boggs (US) LLP |
| 主权项 | 1. A semiconductor apparatus comprising: a package substrate on which a semiconductor device is disposed; a mounting board over which the package substrate is mounted; a first restraint that penetrates through the mounting board and the package substrate, and restrains deformation of the mounting board and the package substrate in a direction in which the mounting board and the package substrate are separated from each other; and a second restraint that is disposed between the mounting board and the package substrate, and restrains deformation of the mounting board and the package substrate in a direction in which the mounting board and the package substrate are closer to each other, wherein the first restraint includes a head that is in contact with a first surface on a side of the mounting board that is farther from the package substrate,a hook that is openable and closable in a direction parallel to a second surface on a side of the package substrate that is farther from the mounting board, and that is hooked on the second surface, anda joining section that joins the head and the hook. | ||
| 地址 | Kawasaki JP | ||