Process for producing substrate and substrate processing method

摘要

The invention provides a process for producing a protective-layer-provided substrate in which a protective layer is formed on a substrate on the surface of which a plurality of structures have been arranged at intervals. The protective layer has a resin layer and a film for chucking. The process includes the steps of forming the resin layer between the respective structures, on the surfaces of the respective structures and on the surface of the substrate having the plurality of the structures; and forming the film for chucking on the resin layer to form the protective layer.

主权项

1. A process for producing a treated substrate by using a protective layer, the process comprising, in stated order (1)-(4):
(1) providing a substrate having on a surface thereof a plurality of respective structures protruding from the surface and arranged at intervals; (2) forming a resin layer (i) to fill a gap between the respective structures, (ii) on surfaces of the respective structures, and (iii) on the surface of the substrate on which the plurality of the structures are arranged; (3) forming a film for chucking on the resin layer to form the protective layer, where the protective layer comprises the resin layer and the film; and (4) subjecting the substrate on which the film has been formed to a vacuum process.