发明名称 Board module and fabrication method thereof
摘要 Affixed to a projection (111) of a glass substrate (110) included in a liquid crystal module (100) are a first ACF (150a), which has low surface tack strength but high connection reliability, and a second ACF (150b), which has high component attaching capability attributed to high surface tack strength. With these, an LSI chip (130), electronic components (150), etc., are mounted on the glass substrate (110), so that high-speed electronic component mounting can be achieved while ensuring connection reliability.
申请公布号 US9007777(B2) 申请公布日期 2015.04.14
申请号 US201013498761 申请日期 2010.05.12
申请人 Sharp Kabushiki Kaisha 发明人 Nagaoka Gen;Hida Yasuhiro;Miyazaki Hiroki
分类号 H05K1/00;H05K1/18;H05K7/00;H01L29/18;H01L33/00;G09G3/36;G02F1/1345;H01L23/00 主分类号 H05K1/00
代理机构 Morrison & Foerster LLP 代理人 Morrison & Foerster LLP
主权项 1. A board module having a plurality of electronic components mounted on a substrate via anisotropic conductive films, the module comprising: a glass substrate having a plurality of lines formed thereon; a first anisotropic conductive film affixed on the glass substrate; a second anisotropic conductive film or nonconductive film affixed on the first anisotropic conductive film; and electronic components disposed on the second anisotropic conductive film or nonconductive film, subjected to pressure bonding, and thereby connected to the lines at least via conductive particles included in the first anisotropic conductive film, wherein the first anisotropic conductive film has higher connection reliability than the second anisotropic conductive film or nonconductive film, the second anisotropic conductive film or nonconductive film has higher surface tack strength than the first anisotropic conductive film, and the first anisotropic conductive film has a higher melt viscosity than a melt viscosity of the second anisotropic conductive film or nonconductive film at a temperature for thermocompression bonding to connect the electronic components to the lines.
地址 Osaka-shi JP