Housing unit with heat sink

摘要

Described herein is an apparatus for dissipating or transferring heat from electronics secured in a housing unit. A housing unit includes a cover having a first fastener part and a base having a second fastener part. The base further includes a support structure for holding a printed circuit board (PCB) with mounted electronic components. A heat sink is placed within the base. The first fastener part and the second fastener part lock the cover and base together, with the heat sink and the PCB being secured between the support structure and the cover.

主权项

1. A housing unit for electronic components, comprising:
a heat sink comprising a lip; a cover including a first fastener part and a side wall structure; a base including a second fastener part and a support structure configured to support from below a printed circuit board (PCB) with mounted electronic components; and the first fastener part and the second fastener part being configured to lock the cover and base together, wherein the heat sink is secured to the housing unit and the PCB is secured to the housing unit only by the lip and a sidewall structure of the heat sink and the PCB being disposed between the support structure and the side wall structure of the cover.