发明名称 |
Method of manufacturing film for film capacitor and film for film capacitor |
摘要 |
When extrusion of a molten resin by means of an extruder is started, a simple polyetherimide resin is melt extruded from a lip portion 7a of a T-die 7, and a film of the simple polyetherimide resin is molded. The molding material is then switched to a resin composition including the polyetherimide resin and a fluorine resin and then a film of the resin composition is continuously extruded and molded from the T-die 7. Having been covered with a very thin film 8a of the simple polyetherimide resin, on a flow passage face of the lip portion 7a of the T-die 7, a resin composition layer 8b including a polyetherimide resin and a fluorine resin, which has affinity with the film 8a, is then formed at a center part. |
申请公布号 |
US9005500(B2) |
申请公布日期 |
2015.04.14 |
申请号 |
US201012970672 |
申请日期 |
2010.12.16 |
申请人 |
Shin-Etsu Polymer Co., Ltd. |
发明人 |
Ote Michimasa;Gonda Takashi;Ishida Junya;Takizawa Kenro;Suzuki Kazuhiro;Morioka Yuzo |
分类号 |
B29C47/10;B29C47/94;B29C47/92;B29C47/00;B29C47/88;C08J5/18;C08L79/08;H01G4/18;H01G13/00;B29C47/14;B29K79/00;B29K105/00 |
主分类号 |
B29C47/10 |
代理机构 |
Arent Fox LLP |
代理人 |
Arent Fox LLP |
主权项 |
1. A method of manufacturing a film for a film capacitor, the method comprising:
injecting a molding material consisting of one or more polyetherimide resins into an extruder, and then melt extruding the film for the film capacitor from a lip portion of a tip end of a T-die; pinching and cooling the extruded film for the film capacitor between a pressure roll and a cooling roll in a pulling unit; and winding the cooled film for the film capacitor with a predetermined thickness by means of a winder, wherein: melt extruding the molding material consisting of one or more polyetherimide resins at a starting step of extrusion operation of the extruder is performed in an inert gas atmosphere obtained by replacing air in the extruder with an inert gas; and switching the molding material consisting of one of more polyetherimide resins to a resin composition obtained by adding 1.0 to 30.0 parts by mass of a fluorine resin to 100 parts by mass of a polyetherimide resin after the molding material consisting of one or more polyetherimide resins is fully extruded and molded, to thereby mold the film for the film capacitor. |
地址 |
Tokyo JP |