Structure and method for edge-emitting diode package having deflectors and diffusers

摘要

A high field of view, low height package and wafer-level packaging process are provided. The top surface of a first wafer has recesses defined by sidewalls, with a reflector, and a floor. The reflector is incident a horizontal light path form an edge-emitting diode on the floor, directing the light path vertically. A second optically diffusing wafer receives the vertically directed light. A vertical ring to surround each recess is wafer-level fabricated on one of the wafers. The vertical ring may have a high aspect ratio to increase light diffusion. The second wafer is connected above the first such that each vertical ring encloses its corresponding recess and such that the light vertically exits the optically diffusing media after spanning the height of the vertical ring. Diode electrical connections are provided for externally controlling the diode. Individual packages are separated by double-dicing the connected wafers between the recesses.

主权项

1. A process comprising:
(a) providing a first substrate wafer having a recess in a top surface defined by sidewalls and a floor; (b) applying a reflector to a portion of the sidewalls; (c) attaching an edge-emitting diode to the floor such that a horizontal light path from the diode will be incident to the reflector, which directs the light path vertically; (d) providing a second substrate wafer having a bottom surface and comprising an optically diffusing media; (e) fabricating a vertical ring on one of the first substrate wafer's top surface surrounding the recess and the second substrate wafer's bottom surface in a position to surround the recess, wherein (e) comprises fabricating the vertical ring from a polymer material by:
(e1) applying a layer of polymer material to one of the bottom surface of the second substrate wafer or the top surface of the first substrate wafer by spin coating, spray coating, or laminating, followed by patterning the layer of polymer material to form the vertical ring therefrom, or(e2) bonding a pre-molded structure to the bottom surface of the second substrate wafer or the top surface of the first substrate wafer with an adhesive; (f) providing an electrical connection to the diode from outside the vertical ring for controlling the diode; and (g) after (a) through (f), connecting the second substrate wafer above the first substrate wafer such that the vertical ring encloses the optically diffusing media and the recess and such that the vertically turned light path is incident to the optically diffusing media.