发明名称 Light emitting device package and lighting system including the same
摘要 A light emitting device package is disclosed. The light emitting device package includes a body, first and second lead frames disposed on the body, and a light emitting device connected to the first and second lead frames, wherein at least one of the first and second lead frames includes first and second regions having different thicknesses.
申请公布号 US9006886(B2) 申请公布日期 2015.04.14
申请号 US201213482147 申请日期 2012.05.29
申请人 LG Innotek Co., Ltd. 发明人 Bak Gyu Hyeong;Kim Myoung Kyo;Ha Tae Uk;Je Kyung Min
分类号 H01L23/48;H01L33/62;H01L33/48;H01L33/64 主分类号 H01L23/48
代理机构 Ked & Associates, LLP 代理人 Ked & Associates, LLP
主权项 1. A light emitting device, comprising: a body; a first lead frame and a second lead frame coupled to the body; a light emitting device electrically connected to the first lead frame and the second lead frame, wherein at least one of the first lead frame or second lead frame includes a first region and a second region, and wherein a thickness of the first region, from a top surface of the at least one of the first or second lead frame in the first region to a bottom surface of the first region, is different than a thickness of the second region of the at least one of the first or second lead frame, from a top surface of the second region to a bottom surface of the second region; and a first protrusion and a first depression formed in an edge of the first lead frame facing the second lead frame, and a second protrusion and a second depression formed in an edge of the second lead frame facing the first lead frame.
地址 Seoul KR