发明名称 |
Light emitting device package and lighting system including the same |
摘要 |
A light emitting device package is disclosed. The light emitting device package includes a body, first and second lead frames disposed on the body, and a light emitting device connected to the first and second lead frames, wherein at least one of the first and second lead frames includes first and second regions having different thicknesses. |
申请公布号 |
US9006886(B2) |
申请公布日期 |
2015.04.14 |
申请号 |
US201213482147 |
申请日期 |
2012.05.29 |
申请人 |
LG Innotek Co., Ltd. |
发明人 |
Bak Gyu Hyeong;Kim Myoung Kyo;Ha Tae Uk;Je Kyung Min |
分类号 |
H01L23/48;H01L33/62;H01L33/48;H01L33/64 |
主分类号 |
H01L23/48 |
代理机构 |
Ked & Associates, LLP |
代理人 |
Ked & Associates, LLP |
主权项 |
1. A light emitting device, comprising:
a body; a first lead frame and a second lead frame coupled to the body; a light emitting device electrically connected to the first lead frame and the second lead frame,
wherein at least one of the first lead frame or second lead frame includes a first region and a second region, and wherein a thickness of the first region, from a top surface of the at least one of the first or second lead frame in the first region to a bottom surface of the first region, is different than a thickness of the second region of the at least one of the first or second lead frame, from a top surface of the second region to a bottom surface of the second region; and a first protrusion and a first depression formed in an edge of the first lead frame facing the second lead frame, and a second protrusion and a second depression formed in an edge of the second lead frame facing the first lead frame. |
地址 |
Seoul KR |