发明名称 |
WORKPIECE PROCESSING METHOD |
摘要 |
PROBLEM TO BE SOLVED: To provide a workpiece processing method capable of easily dividing a workpiece.SOLUTION: A workpiece processing method includes: a modified layer formation step for irradiating a workpiece (11) with a laser beam (L1) of a wavelength having transmissivity to form a modified layer (25) inside the workpiece; and a division step for irradiating the workpiece with a laser beam (25) of the wavelength on a suction side in the vicinity of the suction end of the workpiece along the modified layer after executing the modified layer formation step and dividing the workpiece using the modified layer as a starting point. |
申请公布号 |
JP2015069975(A) |
申请公布日期 |
2015.04.13 |
申请号 |
JP20130199914 |
申请日期 |
2013.09.26 |
申请人 |
DISCO ABRASIVE SYST LTD |
发明人 |
YUHIRA YASUKICHI;KATAYAMA KOICHI;KOYANAGI OSAMU |
分类号 |
H01L21/301;B23K26/38;B23K26/40 |
主分类号 |
H01L21/301 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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