| 摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition which is charged with a large amount of metal oxide, enables formation of a via hole with high resolution by using an alkali developer, and leaves no sediment in a developing apparatus.SOLUTION: The photosensitive resin composition comprises the following components with respect to 100 parts by mass of the whole solid content of the composition: (A) 40 parts by mass to 80 parts by mass of inorganic particles having a primary particle diameter of 0.04 μm to 1.00 μm; (B) 5 parts by mass to 60 parts by mass of a compound including a photopolymerizable unsaturated bond group, a carboxyl group, and/or an acid anhydride group; and (C) 0.01 parts by mass to 10.0 parts by mass of a photopolymerization initiator. |
