| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method of manufacturing a substrate with through hole which allows even a through hole of large aspect ratio to be filled with a metal reliably by a simple process.SOLUTION: In a step for filling a through hole 2 formed in a substrate 1 with a metal, during manufacture of a substrate with a through hole having a through hole filled with a metal, a metal pole 12 having a shape projecting from the formation surface of a base material 7 is formed in the base material 7 different from the substrate 1. The substrate 1 is subjected to electrolytic plating while inserting the metal pole 12 into the through hole 2.</p> |
