| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate film for dicing which is extended sufficiently during expanding process by suppressing generation of sawdust during dicing process, and in which interlayer peeling of each layer is prevented (interlayer strength is maintained) during pickup process.SOLUTION: In a substrate film for dicing formed by laminating in the order of A layer/B layer/C layer, the A layer is composed of a resin composition containing a polymethyl pentene-based resin, the B layer is composed of a resin composition containing at least one kind of component selected from a group consisting of amorphous polyolefin and an olefin-based thermoplastic elastomer, and the C layer is composed of a resin composition containing at least one kind of component selected from a group consisting of branched chain low density polyethylene and straight chain low density polyethylene. |
