发明名称 |
FOLDABLE INTELLIGENT MODULE |
摘要 |
<p>Foldable Intelligent Module is an electronic module with high performance data processing capabilities and powerful peripherals & latest communication protocols. Module consists of rigidflex parts of printed circuit board assembly where rigid parts are foldable one above the other using flex part of it. This provides reduction in overall length of module and adaptation to any small space/curvature. The module is environmental screened to military standard. The module can be used in military, civil and industrial fields for various applications.</p> |
申请公布号 |
IN2975DE2013(A) |
申请公布日期 |
2015.04.10 |
申请号 |
IN2013DE02975 |
申请日期 |
2013.10.07 |
申请人 |
AVIONICS DIVISION, HAL KORWA |
发明人 |
SH. SHESH VARDHAN;SH. DHEERAJ KUMAR;SH. SANJEEV VERMA |
分类号 |
H05K;E01D |
主分类号 |
H05K |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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