发明名称 FOLDABLE INTELLIGENT MODULE
摘要 <p>Foldable Intelligent Module is an electronic module with high performance data processing capabilities and powerful peripherals & latest communication protocols. Module consists of rigidflex parts of printed circuit board assembly where rigid parts are foldable one above the other using flex part of it. This provides reduction in overall length of module and adaptation to any small space/curvature. The module is environmental screened to military standard. The module can be used in military, civil and industrial fields for various applications.</p>
申请公布号 IN2975DE2013(A) 申请公布日期 2015.04.10
申请号 IN2013DE02975 申请日期 2013.10.07
申请人 AVIONICS DIVISION, HAL KORWA 发明人 SH. SHESH VARDHAN;SH. DHEERAJ KUMAR;SH. SANJEEV VERMA
分类号 H05K;E01D 主分类号 H05K
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