| 摘要 |
<p>The present invention relates to an apparatus for cooling an electronic circuit board. The apparatus includes: an electronic circuit board of which upper side is combined with at least one heating element, and a heat dissipation member which discharges heat generated from the heating element to the outside and has a mounting part which is combined with the lower side of the electronic circuit board. The mounting part is convex to have a predetermined curvature upwards or concaved downwards. According to the present invention, adhesion between the mounting part and the electronic circuit board which has a surface area increased by heat deformation by few combination members is increased. Heat generated from the heating element can be quickly discharged to the outside.</p> |
