| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a wiring board which easily suppresses elution or the like of a metal material of a plating layer when the plating layer is deposited on wiring conductors.SOLUTION: The wiring board includes an insulating substrate 1 and a plurality of wiring conductors 2 which are provided on a surface of the insulating substrate 1 and on which a plating layer 3 is deposited. The insulating substrate 1 has, on the surface thereof, a plurality of protrusions 1a provided in a pattern corresponding to each of the plurality of wiring conductors 2, and the plurality of wiring conductors 2 are provided on those surfaces of the plurality of protrusions 1a which are opposite to the insulating substrate 1. Contact between water remaining after plating and the plating layer 3 is suppressed by the protrusions 1a, thereby suppressing elusion of the plating layer 3.</p> |
