LEAD-FREE SOLDER ALLOY, BONDING MATERIAL, AND BONDED ELEMENT

摘要

PROBLEM TO BE SOLVED: To provide an Sn-Bi-based lead-free solder alloy capable of both improving fatigue resistance and suppressing warpage, a bonding material using the lead-free solder alloy, and a bonded element bonded by the bonding material.SOLUTION: A lead-free solder alloy containing 20 to 60 mass% of Bi; 0.005 to 0.4 mass% of Ni; 0.001 to 0.1 mass% of P; and the balance Sn with inevitable impurities, a P/Ni mass ratio being not more than 1/4.