| 摘要 |
PROBLEM TO BE SOLVED: To provide an LED package capable of suppressing a temperature rise of an LED element by enhancing heat dissipation properties.SOLUTION: In an LED package 1, a plurality of LED elements 3 having a single luminous color are mounted on a same substrate 2, and the LED elements 3 are sealed with phosphor-containing resin layers 12-15. A region on the substrate 2 is partitioned into a plurality of annular regions R1-R4, and the thickness of the resin layers in an outside region on the substrate 2 is set to be thicker than that of the resin layers in an inside region of the out side region. Thereby the color temperature of light emitted from an outside region on the substrate 2 is set to be lower than that of light emitted from an inside region of the outside region. |
