| 摘要 |
<p>PROBLEM TO BE SOLVED: To stably secure connection between an interlayer connection conductor penetrating through a plurality of layers and each conductor circuit in a multilayer wiring board.SOLUTION: A large-diameter via 31 is formed on a substrate 10 of a sheet capacitor 7, and a part of a surface electrode 12 located between the substrate 10 and a prepreg sheet 21 is opened so as to be exposed. A small opening 12A is formed on the surface electrode 12, and a small-diameter via 32 opened by smaller diameter than the large-diameter via 31 is formed on the prepreg sheet 21 so as to reach a lower copper foil 23. An interlayer connection conductor 33 is provided inside the large-diameter via 31 and the small-diameter via 32.</p> |
