| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a cutting technique of solid-state image sensor array substrate satisfying two conflicting requirements, for a cover glass essential for the processing of an array substrate where the solid-state image sensor is multifaceted, but unnecessary for the solid-state image sensor alone after being cut.SOLUTION: When individually cutting a solid-state image sensor array substrate 10, where multifaceted solid-state image sensors 1 are fabricated in matrix on a silicon wafer 2, by using a dicing saw 16, the silicon wafer 2 and a glass substrate 8 are fixed to each other, by bonding the matrix-like partition wall 7 of the glass substrate 8 to the back side of a silicon wafer cut line. Subsequently, the front side of the silicon wafer 2 is cut along the cut line with a width wider than the width of the partition wall 7, by using the dicing saw 16.</p> |
