COATING FILM FORMATION DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a coating film formation device capable of forming a uniform coating film on a substrate having a shape in which the width changes in coating film formation of a slit coat method.SOLUTION: Since the discharge width of coating liquid F increases with respect to a circular-shaped wafer W accompanied by an increase in the width of the wafer W in the former part of coating, pressure in a space S inside a storage chamber 25 is gradually increased. Since the discharge width of the coating liquid F decreases accompanied by a decrease in the width of the wafer W in the latter part of coating, the pressure in the space S inside the storage chamber 25 is gradually lowered.