发明名称 PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM, CURED PRODUCT, AND PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide an alkali-developable photosensitive resin composition excellent in developability, dry-to-touch property, and punching resistance, a dry film comprising the composition, cured products thereof, and a printed wiring board having the cured products.SOLUTION: The alkali-developable photosensitive resin composition contains (A) a carboxyl group-containing resin, (B) an inorganic filler, (C) a thermosetting component, and (D) a photopolymerization initiator. The alkali-developable photosensitive resin composition contains, as the carboxyl group-containing resin (A), either (A1) a carboxyl group-containing resin having a phenolic skeleton and (A2) a carboxyl group-containing resin having a cresol novolac type skeleton, or (A3) a carboxyl group-containing resin having a phenolic skeleton and a cresol novolac type skeleton and contains, as the inorganic filler (B), spherical silica.
申请公布号 JP2015064545(A) 申请公布日期 2015.04.09
申请号 JP20140001838 申请日期 2014.01.08
申请人 TAIYO INK MFG LTD 发明人 HARIMA EIJI;MITANI TAKESHI;KONDO SHINOBU;FUKUDA SHINICHIRO
分类号 G03F7/027;G03F7/004;H05K3/28 主分类号 G03F7/027
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