| 摘要 |
The invention provides a resin sealing device, wherein a substrate arranged on a forming die is preheated before being sealed. A resin sealing device used for sealing a chip arranged on the substrate comprises forming dies; lower dies respectively arranged on the forming dies; upper dies respectively arranged opposite to the lower dies; nests arranged on the lower dies and filled with flowable resin; a first conveying device for conveying an unsealed substrate to the foaming dies; a first heater arranged on the first conveying device; a second conveying device for transmitting the substrate provided by the first conveying device to be above the nests and on the working surfaces of the upper dies; and a second heater arranged on the second conveying device. The first heater is used for heating the surface of the unsealed substrate before the substrate is delivered to the foaming dies. The second heater is used for heating the surface of the substrate when the unsealed substrate is delivered to the working surfaces of the upper dies. |
