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发明名称
はんだ組成物
摘要
<p>A solder composition having a mixture of elements including tin, indium, silver, and bismuth, and can include about 30% to 85% tin and about 15% to 65% indium.</p>
申请公布号
JP5696173(B2)
申请公布日期
2015.04.08
申请号
JP20130077363
申请日期
2013.04.03
申请人
发明人
分类号
B23K35/26;B23K35/14;B23K35/40;C22C13/00
主分类号
B23K35/26
代理机构
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