发明名称 COPPER ALLOY MATERIAL AND MANUFACTURING METHOD THEREOF
摘要 {Problems} To provide a copper alloy material that is excellent in bending property, 0.2% yield stress, electrical conductivity, and stress relaxation resistance, and that is suitable in lead frames, connectors, terminal materials, and the like of, for example, parts to be mounted on vehicles and surrounding infrastructures primarily for EVs and HEVs, and solar photovoltaic power generation systems. {Means to solve} A copper alloy material, containing 0.1 to 0.8 mass% of Cr, and 0.01 to 0.5 mass% in total of at least one selected from the group consisting of an additional alloying element group 1 and an additional alloying element group 2 described below, with the balance being copper and unavoidable impurities, wherein in a crystal orientation analysis of a rolled face in an electron backscatter diffraction analysis, the area ratio of grains having an orientation in which a deviation from the Cube orientation {001} <100> is within 15° is 3% or more, and wherein the ratio of coincidence grain boundary £3 in grain boundaries is 20% or more: an additional alloying element group 1: at least one selected from the group consisting of Mg, Ti and Zr in an amount of 0.01 to 0.5 mass% in total; and an additional alloying element group 2: at least one selected from the group consisting of Zn, Fe, Sn, Ag, Si and P in an amount of 0.005 to 0.5 mass% in total.
申请公布号 EP2752498(A4) 申请公布日期 2015.04.08
申请号 EP20120828596 申请日期 2012.08.29
申请人 FURUKAWA ELECTRIC CO., LTD. 发明人 MATSUO, RYOSUKE;KANEKO, HIROSHI
分类号 C22C9/00;C22C1/10;C22C9/02;C22C9/04;C22C9/06;C22C9/10;C22F1/00;C22F1/08;H01B1/02;H01B5/02;H01B13/00 主分类号 C22C9/00
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