发明名称 |
Semiconductor structure and fabrication method thereof |
摘要 |
A semiconductor structure includes a substrate, an oxide layer, a metallic oxynitride layer and a metallic oxide layer. The oxide layer is located on the substrate. The metallic oxynitride layer is located on the oxide layer. The metallic oxide layer is located on the metallic oxynitride layer. In addition, the present invention also provides a semiconductor process for forming the semiconductor structure. |
申请公布号 |
US9000568(B2) |
申请公布日期 |
2015.04.07 |
申请号 |
US201113244948 |
申请日期 |
2011.09.26 |
申请人 |
United Microelectronics Corp. |
发明人 |
Lai Szu-Hao;Wang Yu-Ren;Chen Po-Chun;Lin Chih-Hsun;Tsai Che-Nan;Lin Chun-Ling;Yeh Chiu-Hsien;Sun Te-Lin |
分类号 |
H01L29/51;H01L21/28;H01L29/66 |
主分类号 |
H01L29/51 |
代理机构 |
|
代理人 |
Hsu Winston;Margo Scott |
主权项 |
1. A semiconductor structure, comprising:
a substrate; an oxide layer located on the substrate; a metallic oxynitride layer located on the oxide layer, wherein the metallic oxynitride layer comprises an indium oxynitride layer; a metallic oxide layer located on the metallic oxynitride layer, wherein the metallic oxide layer comprises a hafnium oxide layer or a zirconium oxide layer; and a gate electrode layer directly covering the entire metallic oxide layer. |
地址 |
Science-Based Industrial Park, Hsin-Chu TW |