Fine pitch probes for semiconductor testing, and a method to fabricate and assemble same

摘要

An apparatus for testing electronic devices is disclosed. The apparatus includes a plurality of probes attached to a substrate; each probe capable of elastic deformation when the probe tip comes in contact with the electronic; each probe comprising a plurality of isolated electrical vertical interconnected accesses (vias) connecting each probe tip to the substrate, such that each probe tip of the plurality is capable of conducting an electrical current from the device under test to the substrate. The plurality of probes may form a probe comb. Also disclosed is a probe comb holder that has at least one slot where the probe comb may be disposed. A method for assembling and disassembling the probe comb and probe comb holder is also disclosed which allows for geometric alignment of individual probes.

主权项

1. An apparatus for testing an electronic device comprising:
a plurality of probes, each probe comprising a shank and a probe tip located at the distal end of the shank, wherein the shank elastically deforms when the probe tip contacts a device under test (DUT); a common foot connected to proximal end of each shank, the foot is capable of elastic deformation when the probe tip contacts the DUT; a substrate connected to the common foot; and a plurality of isolated electrical vertical interconnected access (vias) connecting the each probe tip to the an electrically isolated region of the substrate, such that each probe tip of the plurality is capable of conducting an electrical current from the DUT to the region of the substrate.