| 发明名称 | Method for manufacturing liquid discharge head | ||
| 摘要 | A method for manufacturing a liquid discharge head includes a step of preparing a first substrate having an energy generating element at a front surface side thereof; a step of forming a wall member, which is to become a wall for a liquid flow passage, at the front surface side of the first substrate; a step of forming a mask having an opening on the wall member and forming a second substrate, which is composed of silicon and is to become an orifice plate, on the mask; and a step of forming a liquid supply port in the first substrate and a liquid discharge port in the second substrate by supplying an etchant from a back surface side of the first substrate, the back surface being a surface opposite the front surface. | ||
| 申请公布号 | US8999182(B2) | 申请公布日期 | 2015.04.07 |
| 申请号 | US201313921101 | 申请日期 | 2013.06.18 |
| 申请人 | Canon Kabushiki Kaisha | 发明人 | Abo Hiroyuki;Matsumoto Keiji |
| 分类号 | G01D15/00;B41J2/16 | 主分类号 | G01D15/00 |
| 代理机构 | Canon USA Inc. IP Division | 代理人 | Canon USA Inc. IP Division |
| 主权项 | 1. A method for manufacturing a liquid discharge head including a substrate having a liquid supply port; an energy generating element; and an orifice plate having a liquid discharge port, the method comprising: a step of preparing a first substrate having the energy generating element at a front surface side thereof; a step of forming a wall member, which is to become a wall for a liquid flow passage, at the front surface side of the first substrate; a step of forming a mask having an opening on the wall member and forming a second substrate, which is composed of silicon and is to become the orifice plate, on the mask; and a step of forming the liquid supply port in the first substrate and the liquid discharge port in the second substrate by supplying an etchant from a back surface side of the first substrate, the back surface being a surface opposite the front surface. | ||
| 地址 | Tokyo JP | ||