Skew compensation for a stacked die

摘要

An embodiment for skew compensation for a stacked die is disclosed. For an embodiment of an apparatus, an interposer has a first and a second integrated circuit die coupled to the interposer. The first integrated circuit die includes an information generator, a signal delay compensator, and an input/output block. The information generator is configured to determine: a first delay value for a first path of the interposer between the first integrated circuit die and the second integrated circuit die; a second delay value for a second path of the interposer between the first integrated circuit die and the second integrated circuit die; and a difference between the first delay value and the second delay value. The signal delay compensator is coupled to receive the difference and configured to adjust a parameter of the first integrated circuit die to reduce the difference.

主权项

1. An apparatus, comprising:
an interposer; a first integrated circuit die, coupled to the interposer; a second integrated circuit die coupled to the interposer; wherein the first integrated circuit die includes an information generator, a signal delay compensator, and an input/output block; wherein the information generator is configured to:
determine a first delay value for a first path of the interposer between the first integrated circuit die and the second integrated circuit die;determine a second delay value for a second path of the interposer between the first integrated circuit die and the second integrated circuit die; anddetermine a difference between the first delay value and the second delay value; and wherein the signal delay compensator is coupled to receive the difference and configured to adjust a parameter of the first integrated circuit die to reduce the difference.