Protruding terminals with internal routing interconnections semiconductor device

摘要

A semiconductor package includes terminals extending from a bottom surface of the semiconductor package, and a layer of interconnection routings disposed within the semiconductor package. Each terminal includes a first plated section, a second plated section, and a portion of a sheet carrier from which the semiconductor package is built upon, wherein the portion is coupled between the first and second plated sections. Each interconnection routing is electrically coupled with a terminal and can extend planarly therefrom. The semiconductor package also includes at least one die coupled with the layer of interconnection routings. In some embodiments, the semiconductor package also includes at least one intermediary layer, each including a via layer and an associated routing layer. The semiconductor package includes a locking mechanism for fastening a package compound with the interconnection routings and the terminals.

主权项

1. A semiconductor package comprising:
a. interconnection routings forming an interconnection routing layer; b. a die electrically coupled with the interconnection routing layer; c. terminals in communication with the interconnection routing layer and protruding from a bottom surface of the semiconductor package, each terminal including a first plated region, a second plated region, and a metallic strip separating the first plated region and the second plated region, wherein a portion of the each terminal that protrudes from the bottom surface of the semiconductor device includes the metallic strip and the second plated region are a part of; d. a package compound including:
i. a top molding compound encapsulating the interconnection routings and the die; andii. a bottom molding compound surrounding the first plated region of each terminal; and e. a locking mechanism for fastening the package compound with the interconnection routings and the terminals.