| 发明名称 |
SEMICONDUCTOR DEVICE HAVING A MONOLITHIC INTER-TIER VIA (MIV), AND METHOD OF MAKING SAME |
| 摘要 |
A three dimensional semiconductor device includes a first memory device, a second memory device and a via. The via connects the first memory device to the second memory device. |
| 申请公布号 |
US2015091098(A1) |
申请公布日期 |
2015.04.02 |
| 申请号 |
US201314039481 |
申请日期 |
2013.09.27 |
| 申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
HUANG Tsung-Hsien;CHENG Hong-Chen;LEE Cheng-Hung;LIAO Hung-Jen |
| 分类号 |
H01L27/112;H01L23/522 |
主分类号 |
H01L27/112 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A three dimensional semiconductor device comprising:
a first memory device; a second memory device; and a via, wherein the via connects the first memory device to the second memory device. |
| 地址 |
Hsinchu TW |
