发明名称 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, SEMICONDUCTOR DEVICE AND METHOD FOR FORMING RESIST PATTERN
摘要 A photosensitive resin composition which contains: a resin having a phenolic hydroxyl group (component (A)); a compound having a methylol group or an alkoxyalkyl group (component (B)); an aliphatic compound having two or more functional groups which are selected from among an acryloyloxy group, a methacryloyloxy group, a glycidyloxy group and a hydroxyl group (component (C)); and a photosensitive acid generator (component (D)).
申请公布号 WO2015046522(A1) 申请公布日期 2015.04.02
申请号 WO2014JP75925 申请日期 2014.09.29
申请人 HITACHI CHEMICAL COMPANY, LTD. 发明人 IWASHITA KENICHI;KATO TETSUYA;EBIHARA MASAHIKO
分类号 G03F7/038;G03F7/004;G03F7/027 主分类号 G03F7/038
代理机构 代理人
主权项
地址