发明名称 |
TOUCH PANEL MANUFACTURING METHOD |
摘要 |
Disclosed is a touch panel manufacturing method, comprising the steps of: S1) forming a thin film layer on a first substrate; S2) forming a buffer layer on the thin film layer, the thin film layer being located between the first substrate and the buffer layer; S3) forming a sensing layer on the buffer layer, the buffer layer being located between the thin film layer and the sensing layer; S4) forming a second substrate on the sensing layer, the sensing layer being located between the buffer layer and the second substrate; S5) removing the first substrate; S6) using a bonding layer to attach a cover plate to the thin film layer, the bonding layer being located between the cover plate and the thin film layer; S7) removing the second substrate. The present invention satisfies demand for a light, thin and low-cost touch panel. |
申请公布号 |
WO2015043297(A1) |
申请公布日期 |
2015.04.02 |
申请号 |
WO2014CN82576 |
申请日期 |
2014.07.21 |
申请人 |
TPK TOUCH SOLUTIONS (XIAMEN) INC. |
发明人 |
LIN, CHINGSHAN;WU, CHUNYAN;JI, LIANJIE;FANG, FANG |
分类号 |
G06F3/041 |
主分类号 |
G06F3/041 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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