发明名称 |
A STRUCTURE FOR A HEAT TRANSFER INTERFACE AND METHOD OF MANUFACTURING THE SAME |
摘要 |
A heat transfer interface structure and a method of manufacturing the same are disclosed. A substrate has a plurality of raised features formed on at least one surface the substrate. The raised features are deformable under a compressive force and have respective openings at end portions thereof. |
申请公布号 |
WO2015043947(A1) |
申请公布日期 |
2015.04.02 |
申请号 |
WO2014EP69253 |
申请日期 |
2014.09.10 |
申请人 |
ALCATEL LUCENT |
发明人 |
KEMPERS, ROGER SCOTT;AHERN, PAUL;LYONS, ALAN MICHAEL;ROBINSON, ANTHONY |
分类号 |
H01L23/373;H01L23/42;H01L23/433 |
主分类号 |
H01L23/373 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|