| 摘要 |
<p>The present invention relates to an IGBT module. The main purpose is to provide a high efficiency IGBT module capable of preventing the reduction of lifespan due to the thermal expansion and thermal deformation of a heat sink and improving thermal diffusion and thermal emission performance. For the purpose, the IGBT module having a circuit pattern fabricated using cold spray includes a step of fabricating a heat sink; a step of forming a ceramic coating layer by spray-coating the surface of the heat sink with ceramic powder; a step of penetrating a sealing agent into the ceramic coating layer to secure surface brightness and insulating performance; a step of forming the circuit pattern layer of metal on the ceramic coating layer having the sealing agent by a cold spray method; and a step of integrating the heat sink and the IGBT chip by bonding the IGBT chip to the circuit pattern layer.</p> |
