| 摘要 |
An electronic component housing package (10) has an input/output member (3) that is joined to a hole part (20) of a frame body (2) via a brazing material. This input/output member (3) has an upper surface (3a) that is inside a first side wall part (21) and is joined to the first side wall part (21) and a second side wall part (22), and the upper surface is provided with a constricted part (30a) having a narrow width in a portion that is joined to the first side wall part. When the input/output member (3) is joined, the flow of the brazing material in the upper surface (3a) can be controlled by the constricted part (30a). |
