发明名称 |
NOVEL ADHESION PROMOTING AGENTS FOR METALLISATION OF SUBSTRATE SURFACES |
摘要 |
A method is provided for metallisation of non-conductive substrates providing a high adhesion of the deposited metal to the substrate material and thereby forming a durable bond. The method applies a novel combination of a metal oxide compound to promote adhesion and a transition metal plating catalyst compound promoting the metal layer formation. |
申请公布号 |
WO2015044089(A1) |
申请公布日期 |
2015.04.02 |
申请号 |
WO2014EP70140 |
申请日期 |
2014.09.22 |
申请人 |
ATOTECH DEUTSCHLAND GMBH |
发明人 |
LIU, ZHIMING;FU, HAILUO;HUNEGNAW, SARA;BRANDT, LUTZ;MAGAYA, TAFADZWA |
分类号 |
C25D5/50;C23C18/12;C23C18/16;C23C18/18;C23C18/31;C23C18/34;C23C18/36;C23C18/40;C23C24/00;C25D5/18;C25D5/38 |
主分类号 |
C25D5/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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