| 摘要 |
The invention relates to an arrangement (10) for cooling a space, the floor (18) of which has through holes and delimits a cavity (20), comprising at least one cuboid housing (12) which is set up on the floor and of which at least one first side wall is formed at least in part as a heat exchanger surface of a first heat exchanger and a second side wall is formed as a door (29). The arrangement also comprises at least one fan (14, 16) which is disposed in the cavity, the fan being connected in terms of flow to the interior of the housing (12). In order to enable cooling by structurally simple means to the required extent, during which a problem-free adaptation of the cooling performance to the thermal load produced should take place, according to the invention the arrangement (10, 100) is of modular construction, wherein the at least one first heat exchanger (32, 132) forms the heat exchanger surface as first modular part, the housing (12) as second modular part and the at least one fan (14, 16, 114) as third modular part. |
