发明名称 COPPER FOIL WITH CARRIER AND LAMINATED BOARD, PRINTED WIRING BOARD AND ELECTRONIC DEVICE USING SAME, AS WELL AS METHOD FOR PRODUCING PRINTED WIRING BOARD
摘要 <p>PROBLEM TO BE SOLVED: To provide a copper foil with a carrier which adheres suitably to a resin and is excellent in transparency of a resin after removing the copper foil by etching and to provide a laminated board using the same.SOLUTION: There is provided a copper foil with a carrier in which roughened particles are formed on an ultrathin copper layer surface by a roughening treatment, wherein the average roughness Rz of TD of the roughening-treated surface of the ultrathin copper layer is 0.20 to 0.80μm, the 60-degree glossiness of MD of the roughening-treated surface is 76 to 350% and the ratio A/B between the surface area A of the roughened particles and the surface area B obtained when the roughened particles are planarly viewed from the surface side of the copper foil is 1.90 to 2.40.</p>
申请公布号 JP2015061757(A) 申请公布日期 2015.04.02
申请号 JP20140167989 申请日期 2014.08.20
申请人 JX NIPPON MINING & METALS CORP 发明人 NAGAURA YUTA;ARAI EITA;MIKI ATSUSHI;ARAI YASUNORI;NAKAMURO KAICHIRO
分类号 B32B15/01;B32B15/08;C25D1/04;C25D7/06;H05K1/09;H05K1/14;H05K3/20;H05K3/38 主分类号 B32B15/01
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