发明名称 |
COPPER FOIL WITH CARRIER AND LAMINATED BOARD, PRINTED WIRING BOARD AND ELECTRONIC DEVICE USING SAME, AS WELL AS METHOD FOR PRODUCING PRINTED WIRING BOARD |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide a copper foil with a carrier which adheres suitably to a resin and is excellent in transparency of a resin after removing the copper foil by etching and to provide a laminated board using the same.SOLUTION: There is provided a copper foil with a carrier in which roughened particles are formed on an ultrathin copper layer surface by a roughening treatment, wherein the average roughness Rz of TD of the roughening-treated surface of the ultrathin copper layer is 0.20 to 0.80μm, the 60-degree glossiness of MD of the roughening-treated surface is 76 to 350% and the ratio A/B between the surface area A of the roughened particles and the surface area B obtained when the roughened particles are planarly viewed from the surface side of the copper foil is 1.90 to 2.40.</p> |
申请公布号 |
JP2015061757(A) |
申请公布日期 |
2015.04.02 |
申请号 |
JP20140167989 |
申请日期 |
2014.08.20 |
申请人 |
JX NIPPON MINING & METALS CORP |
发明人 |
NAGAURA YUTA;ARAI EITA;MIKI ATSUSHI;ARAI YASUNORI;NAKAMURO KAICHIRO |
分类号 |
B32B15/01;B32B15/08;C25D1/04;C25D7/06;H05K1/09;H05K1/14;H05K3/20;H05K3/38 |
主分类号 |
B32B15/01 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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