| 摘要 |
PROBLEM TO BE SOLVED: To provide a technology for improving efficiency in a step of carrying a substrate in a plasma film forming apparatus.SOLUTION: A plasma film forming apparatus 100 includes an entrance preliminary chamber 10, a fore-stage vacuum preliminary chamber 20, a fore-stage intermediate chamber 30, a film-forming chamber 40, a subsequent stage intermediate chamber 50, a subsequent stage vacuum preliminary chamber 60, and an exit preliminary chamber 70. Respective volumetric capacities of the entrance preliminary chamber 10, the fore-stage intermediate chamber 30, the subsequent stage intermediate chamber 50, and the exit preliminary chamber 70 are smaller than those of respective vacuum preliminary chambers 20, 60 and the film-forming chamber 40. The respective vacuum preliminary chambers 20, 60 are maintained at a lower degree of vacuum than that of the film-forming chamber 40. The entrance preliminary chamber 10, the fore-stage intermediate chamber 30, the subsequent stage intermediate chamber 50, and the exit preliminary chamber 70 are configured so that carrying-out ports thereof are opened after carrying-in ports thereof are closed, or the carrying-in ports are opened after the carrying-out ports are closed when a substrate 5 is carried-in or carried-out from the chambers. |
