| 摘要 |
<p>The device has a receiving unit (24) for receiving the substrate in a working chamber (13) and an adjusting unit (22) for adjusting the substrate. The adjusting device is arranged partially in the working chamber. An embossing unit (20) is provided for embossing the structural materials (1) on the substrate in an embossing process. The working space is admittable before and during the embossing process, particularly continuously with a defined atmosphere. An independent claim is also included for a method for embossing of substrate, particularly semiconductor substrate or wafer.</p> |
