| 摘要 |
<p>Disclosed is a resin composition which is suppressed in warping and rebound properties after thermosetting, and provides a cured film having excellent chemical resistance, heat resistance and flame retardancy. Specifically disclosed is a resin composition containing a polyimide precursor that has a polyether structure and a compound that has a thermally crosslinkable functional group, said resin composition being characterized in that the polyimide precursor has an imidization ratio of 40-98% (inclusive).</p> |
