发明名称 ワイヤ放電加工装置および半導体ウエハ製造方法
摘要 <p>To address the problem of not being able to control the position of severing of an electrical pathway in an article to be machined and insufficiency as a structure for avoiding wire breakage caused by the electrical pathway being severed in simultaneous cutting for an article to be machined by wire electrical discharge machining that uses parallel wire units, this wire electrical discharge machining device is a wire electrical discharge machining device that carries out electrical discharge machining on an article to be machined with the parallel wire units at an electrical discharge machining region, while raising or lowering the article to be machined. The constitution is such that the diameter of wire guide grooves around the rotating axes of first and second vibration control guide rollers changes according to the position in the direction of the axis of rotation.</p>
申请公布号 JP5693747(B2) 申请公布日期 2015.04.01
申请号 JP20130544150 申请日期 2012.06.25
申请人 发明人
分类号 B23H7/10;B23H7/02;B23H9/00 主分类号 B23H7/10
代理机构 代理人
主权项
地址