Light emitting device, method of manufacturing the same, light emitting device package and lighting system

摘要

A light emitting device according to the embodiment includes a conductive support substrate (80) including plural pairs of first and second conductive layers (80a,80b); a light emitting structure layer including a first conductive semiconductor layer (30), a second conductive semiconductor layer (50), and an active layer (40) between the first and second conductive semiconductor layers (30,50) on the conductive support substrate (80); and an electrode (90) on the light emitting structure layer. The first and second conductive layers (30,50) are formed by using the same material.