| 摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition having excellent moist-heat resistance and having, in a cured product of the composition, a high elastic modulus at high temperature and excellent hollow structure retaining property, and to provide a photosensitive film, a method for forming a rib pattern, a method for forming a hollow structure and electronic components using the composition.SOLUTION: The photosensitive resin composition to be used as a rib material or a cap material for forming a hollow structure in an electronic component having the hollow structure comprises (A) a photopolymerizable compound having at least one ethylenically unsaturated group and (B) a photopolymerization initiator. The photosensitive film is obtained from the photosensitive resin composition. In order to significantly improve reliability of an electronic component having a hollow structure, an acrylate compound or a methacrylate compound, specifically an acrylate compound or a methacrylate compound containing an amide group is used as the (A) component. |
