| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a surface treatment method of a conductive base material for packaging a semiconductor which allows for good adhesion to a sealing material or the like, minimization of degradation in electrical characteristics and heat dissipation, low temperature processing, excellent productivity, and reduction of marks such as scratches or rubbing. <P>SOLUTION: The surface treatment method of a conductive base material for packaging a semiconductor includes a roughening step for forming a roughened shape on the surface of a conductive base material for packaging a semiconductor by bringing it into contact with a chemical roughening liquid containing a corrosion inhibitor, sulphuric acid and hydrogen peroxide, the corrosion inhibitor containing 1,2,3-benzotriazol and 5-amino-tetrazole, and a film removing step for removing an organic film formed on the surface in the roughening step by bringing the organic film into contact with an alkaline solution containing amine following to the roughening step. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
