| 摘要 |
According to one embodiment, there is provided a light emitting module (15) including a board (21), a semiconductor light emitting element (45), an electronic component (57), a first pad (28), and a second pad (58). The surface of the first pad (28) on the board (21) is covered with a metal film. The semiconductor light emitting element (45) is mounted on the first pad (28). The surface of the second pad (58) is covered with a metal film. The electric component (57) is mounted on the second pad (58). The semiconductor light emitting element (45) is wire-bonded on the first pad (28) covered with the metal film. The electric component (57) is joined by solder on the second pad (58) covered with the metal film. The metal film covering the first pad (28) has a film structure lower in density than the metal film covering the second pad (58). |
