| 摘要 |
<p>A reflow soldering device (10) is a device that carries out soldering by heating a printed circuit board (W) on which electronic components are mounted. The reflow soldering device (10) is provided with: a transport conveyor belt (14) that transports the printed circuit board (W); a heating furnace (12) that has a fan (22) that blows a gas which is controlled to a prescribed temperature to the printed circuit board (W) on the transport conveyor belt (14); a circuit board detection sensor (16) that detects the printed circuit board (W) transported into the heating furnace (12); and a control unit (18) that controls the rotational speed of the fan according to the detection results of the circuit board detection sensor (16).</p> |
