发明名称 |
Microelectromechanical system |
摘要 |
In various embodiments, a microelectromechanical system may include a chip, a substrate, a signal generator, and a fixing structure configured to fix the chip to the substrate. The chip may be fixed in such a way that, upon an acceleration of the microelectromechanical system, the chip is moved relative to the substrate. Furthermore, a signal may be generated by the movement of the chip by means of the signal generator. |
申请公布号 |
US8991253(B2) |
申请公布日期 |
2015.03.31 |
申请号 |
US201113241333 |
申请日期 |
2011.09.23 |
申请人 |
Infineon Technologies AG |
发明人 |
Theuss Horst |
分类号 |
G01P15/08;G01P15/105;G01P15/11;G01P15/12;G01P15/125 |
主分类号 |
G01P15/08 |
代理机构 |
|
代理人 |
|
主权项 |
1. A microelectromechanical system, comprising:
a chip; a substrate; a signal generator; and a coupling structure configured to couple the chip to the substrate; wherein the chip is coupled in such a way that, upon an acceleration of the microelectromechanical system, the chip is moved relative to the substrate, and wherein a signal is generated by the relative movement of the chip by means of the signal generator; wherein the chip is embodied as a signal detector and evaluator, comprising a signal detection and evaluation circuit; and wherein the chip has a transponder. |
地址 |
Neubiberg DE |