发明名称 Microelectromechanical system
摘要 In various embodiments, a microelectromechanical system may include a chip, a substrate, a signal generator, and a fixing structure configured to fix the chip to the substrate. The chip may be fixed in such a way that, upon an acceleration of the microelectromechanical system, the chip is moved relative to the substrate. Furthermore, a signal may be generated by the movement of the chip by means of the signal generator.
申请公布号 US8991253(B2) 申请公布日期 2015.03.31
申请号 US201113241333 申请日期 2011.09.23
申请人 Infineon Technologies AG 发明人 Theuss Horst
分类号 G01P15/08;G01P15/105;G01P15/11;G01P15/12;G01P15/125 主分类号 G01P15/08
代理机构 代理人
主权项 1. A microelectromechanical system, comprising: a chip; a substrate; a signal generator; and a coupling structure configured to couple the chip to the substrate; wherein the chip is coupled in such a way that, upon an acceleration of the microelectromechanical system, the chip is moved relative to the substrate, and wherein a signal is generated by the relative movement of the chip by means of the signal generator; wherein the chip is embodied as a signal detector and evaluator, comprising a signal detection and evaluation circuit; and wherein the chip has a transponder.
地址 Neubiberg DE